A new technical paper titled “Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges” was published by researchers at the University of California, Santa Barbara and Columbia ...

10-year investment enables key fusion technology development activities on globally unique test platform. The fuel cycle is an essential part of any proposed commercial fusion power plant design – ...

Unity 6.2 introduces Unity AI, replacing Muse and Sentis with integrated generative tools for assets and code, plus Mesh LOD and UI updates. The Inference Engine, formerly Sentis, offers local model ...

Abstract: Recent breakthroughs in heterogeneous integration (HI) using 2.5D and 3D ICs have been key to advances in the semiconductor industry. However, heterogeneous integration has also led to ...

TL;DR: Insiders reveal a new God of War project is in development, shifting from earlier rumors of a Greek prequel to a smaller-scale, Metroidvania-style spinoff. While details remain unconfirmed, ...

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Anthony is a writer who's worked in the games industry for four years. He's a competitive gamer with a soft spot for retro titles. Anthony enjoys speedrunning a few titles, but Simpson's Hit & Run is ...

Governments and humanitarian organizations need reliable data on building and infrastructure changes over time to manage urbanization, allocate resources, and respond to crises. However, many regions ...

Semiconductor packaging has progressed from 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving single micronmeter level interconnecting pitches and over 1000 GB/s bandwidth.