http://www.coolinnovations.comWhile today's high-end ICs offer exceptional processing capabilities, they also generate heavy loads of heat. Providing adequate cooling ...

Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...

A line of hybrid pin-fin heat sinks are made from an array of forged aluminum pin-fin heat sinks that are reflowed onto a copper plate. The hybrid pin fins are available in a wide array of standard ...

Designed to cool surface-mount devices (SMDs) dissipating high heat loads, as well as those featuring small and focused heat sources, the UltraCool IV line of copper heatsinks employ pin fins with low ...

New heat spreading tech delivers 740% increase in circuit power density By Loz Blain May 22, 2022 Experimental configurations showed outstanding cooling capability for the central conformal copper ...

Increasing the processing power of electronic equipment often means that more transistors have to be squeezed into tighter packages. And higher circuit densities increase the amount of heat that must ...

Package heat spreaders can offer a variety of benefits such as protection of the silicon, warpage management, increased reliability, and thermal enhancement, however, there are tradeoffs for every ...